Through-Silicon Vias for 3D Integration

Autor: John H. Lau

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Kategorie: Nanotechnologie
Kategorie: Elektrotechnika
Kategorie: Electronics Engineering
Kategorie: Obvody a komponenty
Naše cena: 207.24 EUR (cca 5040 Kč)
(cena aktualizována 28.01.2026)

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