Through-Silicon Vias for 3D Integration

Autor: John H. Lau

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Kategorie: Electronics Engineering
Kategorie: Nanotechnologie
Kategorie: Elektrotechnika
Kategorie: Obvody a komponenty
Naše cena: 208.52 EUR (cca 5123 Kč)
(cena aktualizována 25.07.2025)

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